技術服務
1. 2.5D & 3D X-Ray非破壞檢測服務
- 1-1 PCB背鑽檢測 (包含Stub Length ,面銅厚,訊號層銅厚,PAD直徑,VIA ,孔銅厚)
- 1-2 半導體玻璃(矽)板(TGV/TSV)檢測
| Item | Configuration |
|---|---|
| Tube | 64 W |
| FOV | Specific |
| Detector | Flat Panel / CCD |
| Resolution | 0.5~500 um/pixel |
| Loader | Specific |
| Device Dimension | ~2x2x2 m3 |
| Device Power | 220-230 V |
| Recon. Image | 256x256~1000x1000 |
| Safety | < 0.5 uSv/hour |
