Yamantaka Technology Co., Ltd. was established in 2018 by DLF Co., Ltd., a leading company with over 30 years of experience. Yamantaka specializes in non-destructive X-ray inspection (AXI) technology. Before its founding, Delifu invested 10 years in independent R&D, securing AXI process patents in Taiwan, the US, and Japan.
The company focuses on applying X-ray technology to:

• PCB back-drill inspection (patents: Taiwan I77116 @2022, US 17/406575 @2023, China pending)
• Semiconductor glass (TGV/TSV) inspection (patent applications in Taiwan, US, and Japan)
• Biomedical fields, utilizing 2D/2.5D/3D imaging for non-destructive testing

CT Inspection Limitations

• Ineffective for objects with aspect ratios >8
• Time-consuming: slicing and analysis require 2–4+ hours

AXI Technology Advantages

• Non-destructive: Enables inspection of flat/board-shaped objects
• Fast: Inspection completed in minutes
• Customizable: Proprietary AXI mechanism design
• Algorithm: Patented 3D reconstruction algorithm
• AI Integration: AI-based image inspection system development

Technical Features

1. Specialized X-ray Algorithm: Patented technology for thin, flat samples, overcoming the traditional 3D CT limitation of slicing objects with an aspect ratio >8. Enables direct non-destructive imaging.
2. Patented 3D Reconstruction: Significantly reduces imaging time and supports fully customizable AI inspection systems.
3. Flexible Models: Develops both offline analysis systems and inline fast-screening systems.